Tanemasa Asano

1. Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
   2005/04/01 by Naoya Watanabe, Youhei Ootani, Tanemasa Asano · 2 citations
   Engineering · #Electronic Packaging and Soldering Technologies #3D IC and TSV technologies #Advanced Materials and Mechanics
2. Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump
   2013/04/01 by Lijing Qiu, Akihiro Ikeda, Kazuhiro Noda +2 · 3 citations
   Engineering · Materials Science · #3D IC and TSV technologies #Electronic Packaging and Soldering Technologies #Copper Interconnects and Reliability