Kazuhiro Noda

1. Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump
   2013/04/01 by Lijing Qiu, Akihiro Ikeda, Kazuhiro Noda +2 · 3 citations
   Engineering · Materials Science · #3D IC and TSV technologies #Electronic Packaging and Soldering Technologies #Copper Interconnects and Reliability