2012/08/13 by F. Nardi, Federico Nardi, Stefano Larentis +4 · 203 citations
Engineering · Neuroscience · #Advanced Memory and Neural Computing #Computer science #Electrical engineering #Electronic engineering #Engineering #Ferroelectric and Negative Capacitance Devices #Materials science #Nanotechnology #Neuroscience and Neural Engineering #Optoelectronics #Physics #Power (physics) #Reliability (semiconductor) #Reset (finance) #Resistive random-access memory #Set (abstract data type) #Thermodynamics #Tin #Voltage
paper · doi:10.1109/ted.2012.2202319
published in IEEE Transactions on Electron Devices 59(9), 2461-2467 (Institute of Electrical and Electronics Engineers)
openalex publication_date 2012/08/13 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/29
Resistive-switching random access memory (RRAM) based on the formation and the dissolution of a conductive filament (CF) through insulating materials, e.g., transition metal oxides, may find applications as novel memory and logic devices. Understanding the resistive-switching mechanism is essential for predicting and controlling the scaling and reliability performances of the RRAM. This paper addresses the set/reset characteristics of RRAM devices based on\hboxHfOx. The set process is analyzed as a function of the initial high-resistance state and of the current compliance. The reset process is studied as a function of the initial low-resistance state. Finally, the intermediate set states, obtained by set at variable compliance current, and reset states, obtained by reset at variable stopping voltage, are characterized with respect to their reset voltage, allowing for a microscopic interpretation of intermediate states in terms of different filament morphologies.