Deep-Cryogenic Modeling of 22-nm FDSOI MOSFETs based on BSIM-IMG

2025/11/27 by Debargha Dutta, Kerim Türe, Dutta, Debargha +7
Engineering · #Advancements in Semiconductor Devices and Circuit Design #Radio Frequency Integrated Circuit Design #Electronic Packaging and Soldering Technologies

paper · pdf · doi:10.48550/arxiv.2511.22297

Abstract

We present a modeling approach based on the BSIM-IMG compact model to capture the deep-cryogenic behavior of MOSFET devices in a 22-nm FDSOI technology. The modeling flow is based on DC measurements to extract static parameters including variability and RF measurements to extract dynamic parameters. Modifications to the mobility equations are introduced to enable the modeling of intersubband scattering effect. The extracted models are used to enable deep-cryogenic simulations of a digital-to-analog converter (DAC), showing close agreement with measurement results.

Citations

• An Integrated Deep-Cryogenic Temperature Sensor in CMOS Technology for Quantum Computing Applications
• Method for efficient large-scale cryogenic characterization of CMOS technologies

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