2015/01/01 by H. Deng, Hui Deng, K. Endo +3 · 72 citations
Engineering · Physics and Astronomy · #Abrasive #Chemical-mechanical planarization #Composite material #GaN-based semiconductor devices and materials #Gallium nitride #Layer (electronics) #Materials science #Metal and Thin Film Mechanics #Metallurgy #Plasma #Polishing #Semiconductor materials and devices #Surface finish #Surface roughness
paper · pdf · doi:10.1016/j.cirp.2015.04.002
published in CIRP Annals 64(1), 531-534 (Elsevier BV)
openalex publication_date 2015/01/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/08/05