Luca Magagnin

1. Review—Ruthenium as Diffusion Barrier Layer in Electronic Interconnects: Current Literature with a Focus on Electrochemical Deposition Methods
   2018/12/10 by Roberto Bernasconi, Luca Magagnin · 1 citation
   Materials Science · Engineering · #Copper Interconnects and Reliability #Semiconductor materials and devices #Electrodeposition and Electroless Coatings
2. Copper electrodeposition from a chloride free deep eutectic solvent
   2015/10/25 by Roberto Bernasconi, Mandana Zebarjadi, Luca Magagnin · 1 citation
   Chemical Engineering · Chemistry · Engineering · #Chemical engineering #Chemistry #Chloride #Choline chloride #Copper #Deep eutectic solvent #Electrochemical Analysis and Applications #Electrochemistry #Electrode #Electrodeposition and Electroless Coatings #Electrolyte #Ethylene glycol #Eutectic system #Inorganic chemistry #Ionic liquids properties and applications #Organic chemistry #Solvent