2018/12/10 by Roberto Bernasconi, Luca Magagnin · 1 citation
Materials Science · Engineering · #Copper Interconnects and Reliability #Semiconductor materials and devices #Electrodeposition and Electroless Coatings
paper · pdf · doi:10.1149/2.0281901jes
openalex publication_date 2018/12/10 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/23
Ruthenium is one of themost promising candidates to replace tantalum and titanium based diffusion barrier layers inmicroelectronics. \nIts unique properties allow the deposition of ultrathin layers with controlled thickness by means of a wide variety of different \ntechniques. Ruthenium barriers are characterized by good thermal stability, low resistivity and great adherence. Moreover, the \ncopper filling deposited during the Damascene process can be directly applied on the barrier without the need of a seed layer. As \na consequence of the industrial interest in developing new ruthenium based interconnects technologies, a significant literature has \nbeen produced in the last few years. The scope of the present work is to collect and analyze the literature on the topic, investigating \nin this way the technologies developed in the past and the current development stage of ruthenium based barrier layers. Due to their \nmultiple advantages, a special focus is devoted to the manufacturing of ruthenium diffusion limiters by mean of wet electrochemical \nprocesses.