Fundamental understanding and modeling of reactive sputtering processes

2005/01/09 by S. Berg, T. Nyberg, Tomas Nyberg · 704 citations
Chemistry · Engineering · Materials Science · #Characterization (materials science) #Chemistry #Computer science #Copper Interconnects and Reliability #Deposition (geology) #Engineering #Materials science #Metal and Thin Film Mechanics #Nanotechnology #Physical chemistry #Process (computing) #Process control #Process engineering #Semiconductor materials and devices #Sputtering #Stoichiometry #Thin film

paper · doi:10.1016/j.tsf.2004.10.051

published in Thin Solid Films 476(2), 215-230 (Elsevier BV)

openalex publication_date 2005/01/09 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28

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