2019/06/26 by D. Rosenberg, Steven Weber, Rosenberg, D. +30
Engineering · Materials Science · Physics and Astronomy · #Electron and X-Ray Spectroscopy Techniques #Electronic and Structural Properties of Oxides #FOS: Physical sciences #Quantum Physics (quant-ph) #Semiconductor materials and devices #Superconductivity (cond-mat.supr-con) #cond-mat.supr-con #quant-ph
paper · pdf · doi:10.48550/arxiv.1906.11146
openalex publication_date 2019/06/26 · arxiv created 2019/07/24 · arxiv updated 2019/07/25 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we discuss work being done in our group as well as in the broader community, focusing on the role of 3D integration and packaging in quantum processing with solid-state qubits.