3D integrated superconducting qubits

2017/06/19 by D. Rosenberg, D. Kim, R. Das +12 · 3 citations
Physics and Astronomy · #quant-ph

paper · pdf · doi:10.1038/s41534-017-0044-0

published as npj Quantum Informationvolume 3, Article number: 42 (2017)

arxiv created 2017/06/19 · arxiv updated 2018/12/24

Abstract

As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T₁, T_2,\rmecho > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.

Cited by

• Barbell Codes: qLDPC Codes for Superconducting Quantum Hardware
• From GDSII to Wafer: EDA Design Flow and Data Conversion for Wafer-Scale Manufacturing of Superconducting Quantum Chips
• CMOS-compatible processing and room-temperature characterization on wafer-level for scalable quantum computing

Related

• High Coherence in a Tileable 3D Integrated Superconducting Circuit Architecture
• Analysis of a 3D Integrated Superconducting Quantum Chip Structure
• 3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
• Fluxonium Qubits in a Flip-Chip Package
• Performance Characterization of a Multi-Module Quantum Processor with Static Inter-Chip Couplers