2021/05/25 by Hasitha Jayatilleka, Harel Frish, Ranjeet Kumar +5
Computer Science · Engineering · Physics and Astronomy · #Engineering #Fabrication #Materials science #Mechanical engineering #Nanotechnology #Neural Networks and Reservoir Computing #Optoelectronics #Photonic Crystals and Applications #Photonic and Optical Devices #Resonator #Silicon #Silicon photonics #Trimming #Wafer #physics.app-ph #physics.optics
paper · pdf · doi:10.1109/jlt.2021.3079801
published as in Journal of Lightwave Technology, vol. 39, no. 15, pp. 5083-5088, Aug.1, 2021 · 6 Pages, 5 figures. Accepted for publication in Journal of Lightwave Technology, 03 May 2021
openalex publication_date 2021/05/25 · openalex created_date 2021/06/07 · arxiv created 2022/03/04 · arxiv updated 2022/03/08 · openalex updated_date 2026/08/05
Silicon ring resonator-based devices, such as modulators, detectors, filters, and switches, play important roles in integrated photonic circuits for optical communication, high-performance computing, and sensing applications. However, the high sensitivity to fabrication variations has limited their volume manufacturability and commercial adoption. Here, we report a low-cost post-fabrication trimming method to tune the resonance wavelength of a silicon ring resonator and correct for fabrication variations at wafer-scale. We use a Ge implant to create an index trimmable section in the ring resonator and an on-chip heater to apply a precise and localized thermal annealing to tune and set its resonance to a desired wavelength. We demonstrate resonance wavelength trimming of ring resonators fabricated across a 300 mm silicon-on-insulator (SOI) wafer to within +/-32 pm of a target wavelength of 1310 nm, providing a viable path to high-volume manufacturing and opening up new practical applications for these devices.