1995/08/01 by Matthew J. O’Keefe, M. J. O’Keefe, John T. Grant +2 · 1 citation
Engineering · Materials Science · Physics and Astronomy · #Copper Interconnects and Reliability #Metal and Thin Film Mechanics #Semiconductor materials and interfaces
paper · doi:10.1007/bf02652968
crossref issued 1995/08/01 · crossref published 1995/08/01 · crossref published-print 1995/08/01 · openalex publication_date 1995/08/01 · crossref created 2007/07/06 · crossref deposited 2022/05/15 · openalex created_date 2025/10/10 · crossref indexed 2026/05/13 · openalex updated_date 2026/07/23