15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014/03/17 by Bui Thanh Tung, Fumiki Kato, Naoya Watanabe +3 · 1 citation
Engineering · #3D IC and TSV technologies #Electronic Packaging and Soldering Technologies #Advanced MEMS and NEMS Technologies

paper · doi:10.7567/jjap.53.04eb04

Abstract

In this paper, we report the development of reliable fine-pitch micro bump interconnections that used a high-precision room-temperature bonding approach. The accuracy of the bonding process is improved by modifying conventional bump/planar-bonding-pad interconnections to form self-aligned micro bumps/truncated inverted pyramid (TIP) bonding pads, i.e., misalignment self-correction elements (MSCEs). Thermosonic flip-chip bonding (FCB) is utilized to form reliable bonds between these MSCEs at acceptable low temperatures. By applying the proposed bonding approach, the demonstration of fine-pitch Cu bump to Au bonding pad interconnects chip stacking has been realized. Microstructure analyses reveal that 15-µm-pitch micro bump joints are fabricated at room temperature.

Cited by

• Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement. [europepmc]

Related

• Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump
• Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Circuits in Flexible Electronics
• Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
• Low pressure Au–Au bonding using flat-topped micro-bump Au arrays fabricated by Au film transfer and coining methods
• Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration