2024/10/15 by Hui Wan, Yu Shu, Shuo Chen +4 · 1 voice
Engineering · #3D IC and TSV technologies #Adhesion, Friction, and Surface Interactions #Electronic Packaging and Soldering Technologies
paper · doi:10.1088/2631-7990/ad8736
openalex publication_date 2024/10/15 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/22
Abstract Surface tension-induced shrinkage of heterogeneously bonded interfaces is a key factor in limiting the performance of nanostructures. Herein, we demonstrate a laser-induced thermo-compression bonding technology to suppress surface tension-induced shrinkage of Cu–Au bonded interface. A focused laser beam is used to apply localized heating and scattering force to the exposed Cu nanowire. The laser-induced scattering force and the heating can be adjusted by regulating the exposure intensity. When the ratio of scattering forces to the gravity of the exposed nanowire reaches 3.6 × 10 3 , the molten Cu nanowire is compressed into flattened shape rather than shrinking into nanosphere by the surface tension. As a result, the Cu–Au bonding interface is broadened fourfold by the scattering force, leading to a reduction in contact resistance of approximately 56%. This noncontact thermo-compression bonding technology provides significant possibilities for the interconnect packaging and integration of nanodevices.