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Gemini: Mapping and Architecture Co-exploration for Large-scale DNN Chiplet Accelerators

2023/12/27 by Jingwei Cai, Cai, Jingwei, Zuotong Wu +13 · 10 citations
Computer Science · Engineering · #3D IC and TSV technologies #FOS: Computer and information sciences #Hardware Architecture (cs.AR) #Interconnection Networks and Systems #Low-power high-performance VLSI design

paper · pdf · doi:10.48550/arxiv.2312.16436

openalex publication_date 2023/12/27 · openalex created_date 2023/12/30 · openalex updated_date 2026/07/28

Abstract

Chiplet technology enables the integration of an increasing number of transistors on a single accelerator with higher yield in the post-Moore era, addressing the immense computational demands arising from rapid AI advancements. However, it also introduces more expensive packaging costs and costly Die-to-Die (D2D) interfaces, which require more area, consume higher power, and offer lower bandwidth than on-chip interconnects. Maximizing the benefits and minimizing the drawbacks of chiplet technology is crucial for developing large-scale DNN chiplet accelerators, which poses challenges to both architecture and mapping. Despite its importance in the post-Moore era, methods to address these challenges remain scarce.

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