Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface

2011/01/01 by Kazuya Yamamura, K. Yamamura, Tatsuya Takiguchi +9 · 16 citations
Materials Science · Engineering · #Diamond and Carbon-based Materials Research #Advanced Surface Polishing Techniques #Metal and Thin Film Mechanics

paper · doi:10.1016/j.cirp.2011.03.072

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• Towards atomic-scale smooth surface manufacturing of β-Ga2O3 via highly efficient atmospheric plasma etching
• Atomic surface of diamond induced by novel green photocatalytic chemical mechanical polishing with high material removal rate
• Multi-physical field coupling polishing of diamond for atomic-scale damage-free surface
• Energy beam-based direct and assisted polishing techniques for diamond: A review
• Review of physicochemical-assisted nanomanufacturing processes for wide-bandgap semiconductor wafers
• Mechanisms of tool-workpiece interaction in ultraprecision diamond turning of single-crystal SiC for curved microstructures
• Investigation of Embedded Si/C System Exposed to a Hybrid Reaction of Centrifugal-Assisted Thermite Method. [europepmc]
• Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping. [europepmc]
• Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties. [europepmc]
• Study on Improving the Precise Machinability of Single Crystal SiC by an Ultrasonic-Assisted Hybrid Process. [europepmc]
• Investigation of oxidation mechanism of SiC single crystal for plasma electrochemical oxidation. [europepmc]
• Polishing Approaches at Atomic and Close-to-Atomic Scale. [europepmc]
• A Review of Emerging Technologies in Ultra-Smooth Surface Processing for Optical Components. [europepmc]
• Mechanism of OH*-Modified 4H-SiC Surface with Scratches Based on ReaxFF MD Simulation. [europepmc]