2016/06/06 by K. Praveen Kumar, Ali Khalatpour, Kumar, K +7
Engineering · Materials Science · #CCD and CMOS Imaging Sensors #FOS: Physical sciences #Optics (physics.optics) #Silicon Nanostructures and Photoluminescence #Thin-Film Transistor Technologies
paper · pdf · doi:10.48550/arxiv.1606.01834
openalex publication_date 2016/06/06 · openalex created_date 2016/06/24 · openalex updated_date 2026/07/28
In this paper, we simulate a front surface inverted pyramidal grating texture on 2 to 400 micron thick silicon and optimize it to derive maximum photocurrent density from the cell. We identify a one size fits all front grating period of 1000 nm that leads to maximum photo-absorption of normally incident AM1.5g solar spectrum in silicon (configured with a back surface reflector) irrespective of the thickness of the crystalline silicon absorbing layer. With the identification of such universally optimized periodicity for the case of an inverted pyramidal grating texture, a common fabrication process can be designed to manufacture high-efficiency devices on crystalline silicon regardless of wafer thickness. In order to validate the results of the simulation, we fabricated high resolution inverted pyramidal textures on a 400 micron thick silicon wafer with electron beam lithography to compare the reflectance from submicron and wavelength scale periodic textures. The experimental reflectance measurements on textures confirm that a 1000 nm period grating texture performs better than a 500 nm period texture in reducing reflectance, in agreement with the simulations.