Uneven Current Distribution Modeling and Random Walk based Variation\n Analysis for interconnect Electromigration Estimation

2017/12/23 by Karthik Airani, Airani, Karthik, Rohit Guttal +1
Engineering · Materials Science · #Applied Physics (physics.app-ph) #Copper Interconnects and Reliability #Electromagnetic Compatibility and Noise Suppression #Electronic Packaging and Soldering Technologies #FOS: Physical sciences #Integrated Circuits and Semiconductor Failure Analysis #Semiconductor materials and devices

paper · pdf · doi:10.48550/arxiv.1712.08722

openalex publication_date 2017/12/23 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28

Abstract

In this paper, we modeled and simulated uneven current distribution for\non-die interconnect structure. We show significant difference when considering\nuneven current distribution. Finite Element Method approach is used to analyze\nvarious variation effects. Blech length effect and analytical EM lifetime\ncalculation is used to quickly identify on-die EM weak wires. We propose a\nrandom walk based approach to evaluate on-die variation impact on\nelectromigration reliability. Experimental results show substantial EM\ndegradation with variation effects present.\n

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