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Timing performances of front-end electronics with 3D-trench silicon sensors

2023/01/26 by Gian Matteo Cossu, A. Lai, Cossu, Gian Matteo +1
Engineering · Physics and Astronomy · #CCD and CMOS Imaging Sensors #FOS: Physical sciences #Instrumentation and Detectors (physics.ins-det) #Particle Detector Development and Performance #Radiation Detection and Scintillator Technologies

paper · pdf · doi:10.48550/arxiv.2301.11165

openalex publication_date 2023/01/26 · openalex created_date 2023/01/28 · openalex updated_date 2026/07/28

Abstract

Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of track densities in the foreseen experimental conditions. A promising solution to gain high-resolution performance at the sensor level is given by so-called 3D silicon sensors. The excellent intrinsic time resolution of a special case of 3D sensors, the trench type, is limited by residual non-uniformities in the duration of the induced currents. The intrinsic contribution of the sensor to the total time resolution of the system, when the detector is coupled to a front-end electronics, depends on the characteristics of the electronics itself and can be minimized with a proper design. This paper aims to analyze the possible performance in the timing of a typically-used front-end circuit, the Trans-Impedance Amplifier, considering different possible configurations. Evidence of the preferred modes of operation in sensor read-out for timing measurement will be given.

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