Lo, Chun-Li

1. Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature
   2019/01/23 by Chun‐Li Lo, Lo, Chun-Li, M. Catalano +21 · 1 citation
   Engineering · Materials Science · #Copper Interconnects and Reliability #FOS: Physical sciences #Ferroelectric and Negative Capacitance Devices #Materials Science (cond-mat.mtrl-sci) #Semiconductor materials and devices