Jae-Myeong Shin
- Improving bending fatigue lifetime and interfacial adhesion of Cu–Mn flexible interconnects using self-forming nanolayer
2026/01/01 by Seongi Lee, Jae-Myeong Shin, Jongsung Lee +5 · 1 voice
Engineering · #Advanced Sensor and Energy Harvesting Materials #Electronic Packaging and Soldering Technologies #Nanomaterials and Printing Technologies