2019/06/22 by Xingkai Lin, Congchun Zhang, Shenyong Yang +4 · 25 citations
Engineering · Materials Science · Physics and Astronomy · #Annealing (glass) #Ceramic #Chemical engineering #Composite material #Copper Interconnects and Reliability #Materials science #Microstructure #Nanotechnology #Semiconductor materials and devices #Semiconductor materials and interfaces #Temperature coefficient #Thin film
paper · doi:10.1016/j.tsf.2019.06.036
published in Thin Solid Films 685, 372-378 (Elsevier BV)
openalex publication_date 2019/06/22 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28