2000/11/14 by V. A. Gritsenko, P. M. Lenahan, Gritsenko, V. A. +6
Engineering · Physics and Astronomy · #Advancements in Semiconductor Devices and Circuit Design #Condensed Matter (cond-mat) #FOS: Physical sciences #Integrated Circuits and Semiconductor Failure Analysis #Semiconductor materials and devices #cond-mat
paper · pdf · doi:10.48550/arxiv.cond-mat/0011241
4 pages, LaTex, 1 gif file with 2 figures
arxiv created 2000/11/14 · openalex publication_date 2000/11/14 · arxiv updated 2009/11/30 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
A failure of chips in a huge amount of modern electronic devices is connected as a rule with the undesirable capturing of charge (electrons and holes) by traps in a thin insulating film of silicon oxide in transistors. It leads to a breakdown of transistors or to a destructive change of their characteristics. It is suggested that silicon oxide will be replaced in the next generation of nanoscale devices by silicon oxynitride. Therefore, it is very important to understand the nature of traps in this material. We discuss this nature using the quantum-chemical simulation.