2021/11/06 by Yulong Bao, Bin Xu, Bao, Yulong +11
Computer Science · Engineering · #Advanced Sensor Technologies Research #Applied Physics (physics.app-ph) #FOS: Physical sciences #Materials Science (cond-mat.mtrl-sci) #Refrigeration and Air Conditioning Technologies #Sensor Technology and Measurement Systems
paper · pdf · doi:10.48550/arxiv.2111.06250
openalex publication_date 2021/11/06 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
This article introduces a thin-film thermocouple temperature sensor with symmetrical electrode structure. It uses PI film as a flexible substrate. Cu film and CuNi film made by MEMS manufacturing process as positive and negative electrodes. The device itself has the advantages of miniature, bendable and fast response speed. To reduce the film resistance value. Conducting metal film thickness and sputtering substrate temperature optimization experiments. The critical dimensions of Cu/CuNi film are 650nm and 400nm. The best sputtering substrate temperature for Cu/CuNi films is 100 degrees Celsius and 150 degrees Celsius. Testing the adhesion of thin film thermocouples using the peel-off method. The test result is 9.4N. Finally, the film thermocouple temperature sensor is subjected to a temperature static calibration experiment. The result shows that the actual potential difference error is within 1 degrees Celsius. It belongs to the second class standard in the formulation of thermocouple standards in my country. Through curve fitting, the corresponding relationship between temperature and potential difference is more accurate.