2026/03/04 by Bernardo S. Dias, Reynolds Dziobek-Garrett, Gabriella Mentasti +7
Materials Science · Engineering · #2D Materials and Applications #Graphene research and applications #Advanced Sensor and Energy Harvesting Materials
paper · pdf · doi:10.1021/acsnano.6c04231
2D materials and their monolayers have attracted widespread interest by virtue of their unique electronic and optical properties. In addition to their remarkable physical characteristics, their atomically thin nature enables integration in ultracompact photonic and electronic devices, with potential for dynamic tunability via strain, charge carrier modulation or heterostructure engineering. While early research relied on micrometer-scale mechanically exfoliated flakes, recent advances─particularly gold-assisted exfoliation of transition metal dichalcogenides (TMDCs)─have enabled the preparation of high-quality, large-area monolayers, facilitating scalable device integration. For the field of nanophotonics in particular, the ability to transfer large-area 2D materials onto both flat and patterned substrates is essential for the development of functional devices. However, existing transfer techniques are often limited in scalability, compatibility with structured surfaces, or preservation of material quality. Here, we present a versatile and reliable transfer method of large-area monolayers and hBN/monolayer heterostructures onto both flat and nanostructured substrates. Our approach, based on the physical properties of low-density polyethylene, enhances excitonic emission of TMDCs and is compatible with a variety of device architectures. We demonstrate its applicability by fabricating devices that modulate the photoluminescence of TMDC monolayers through the manipulation of the photonic environment, strain or electrical gating. We further demonstrate the fabrication of van der Waals heterostructures using the same method. By enabling clean transfer of a wide range of monolayers and heterostructures, this technique offers a practical pathway for the development of next-generation optoelectronic platforms with improved functionality, scalability, and tunability.