2020/10/14 by Santanu Sinha, Subhadeep Roy, Alex Hansen
Materials Science · Mathematics · Physics and Astronomy · #Bundle #Composite material #Computer science #Condensed matter physics #Fiber bundle #Force Microscopy Techniques and Applications #Load sharing #Material Dynamics and Properties #Materials science #Mathematics #Mechanics #Noise (video) #Percolation (cognitive psychology) #Percolation threshold #Physics #Statistical physics #Statistics #Stress (linguistics) #Theoretical and Computational Physics #Thermal #Thermal fluctuations #Thermodynamics #Uncorrelated #cond-mat.dis-nn #cond-mat.stat-mech
paper · pdf · doi:10.1016/j.physa.2021.125782
11 pages, 8 figures
arxiv created 2020/10/14 · openalex publication_date 2021/01/27 · arxiv updated 2021/02/24 · openalex created_date 2025/10/10 · openalex updated_date 2026/08/05
We study the competition between thermal fluctuations and stress enhancement in the failure process of a disordered system by using a local load sharing fiber bundle model. The thermal noise is introduced by defining a failure probability that constitutes the temperature and elastic energy of the fibers. We observe that at a finite temperature and low disorder strength, the failure process, which nucleates in the absence of any thermal fluctuation, becomes spatially uncorrelated when the applied stress is sufficiently low. The dynamics of the model in this limit lies closely to the universality class of ordinary percolation. When applied stress is increased beyond a threshold value, localized fractures appear in the system which grow with time. We identify the boundary between the localized and random failure process in the space of temperature and applied stress, and find that the threshold of stress corresponding to the onset of localized crack growth increases with the increase of temperature.