2004/11/30 by M. Labudovic, J. Li · 1 citation
Engineering · Chemistry · #Semiconductor Lasers and Optical Devices #Photonic Crystal and Fiber Optics #Spectroscopy and Laser Applications #Heat sink #Thermoelectric cooling #Laser #Materials science #Diode #Semiconductor laser theory #Optoelectronics #Thermal resistance #Thermoelectric effect #Laser diode #Thermal management of high-power LEDs #Electronic engineering #Mechanical engineering #Optics #Heat transfer #Engineering #Mechanics #Physics
paper · doi:10.1109/tcapt.2004.838874
openalex publication_date 2004/11/30 · openalex created_date 2025/10/10 · openalex updated_date 2026/06/11
The pump laser is a key module in optical amplifiers for long-haul fiber optic telecommunication systems. Its core component is a semiconductor laser diode mounted on a thermoelectric cooler. It is of crucial importance to maintain the laser diode temperature in a narrow range during operation in order to achieve satisfactory performance and reliability of the module. Therefore, a proper thermal management solution is very important to the pump module design. In this paper, a three-dimensional finite element analysis on thermoelectric cooling is presented. The modeling results show good agreement with the experimental results obtained by IR thermometry. When the heat source has a high power dissipation and a small footprint compared to the size of the heat sink, the spreading resistance becomes important. To analyze the maximum performance of the heat sink, both single and dual pump module configurations are considered.