Failure mechanisms of PBGA packages under coupled humidity-thermal-electrical fields: Electrochemical migration behavior and multi-physics simulation

2026/07/25 by Jiayue Wen, Shang Wang, Yunxuan Zhang +3

paper · doi:10.1016/j.microrel.2026.116258

crossref created 2026/07/25 · crossref deposited 2026/08/04 · crossref indexed 2026/08/04 · crossref issued 2026/10/01 · crossref published 2026/10/01 · crossref published-print 2026/10/01