2018/11/28 by Jiyoung Jung, Sangryun Lee, Jung, Jiyoung +5
Engineering · Materials Science · #Advanced Thermoelectric Materials and Devices #Composite Material Mechanics #FOS: Physical sciences #Materials Science (cond-mat.mtrl-sci) #Thermal properties of materials
paper · pdf · doi:10.48550/arxiv.1811.11340
openalex publication_date 2018/11/28 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
We obtained the analytical expression for the effective thermoelectric properties and dimensionless figure of merit of a composite with interfacial electrical and thermal resistances using a micromechanics-based homogenisation. For the first time, we derived the Eshelby tensor for a spherical inclusion as a function of the interfacial resistances and obtained the solutions of the effective Seebeck coefficient and the electrical and thermal conductivities of a composite, which were validated against finite-element analysis (FEA). Our analytical predictions well match the effective properties obtained from FEA with an inclusion volume fraction up to 15%. Because the effective properties were derived with the assumption of a small temperature difference, we discuss a heuristic method for obtaining the effective properties in the case where a thermoelectric composite is subjected to a large temperature difference.