Maximizing waveguide integration density with multi-plane photonics

2017/08/15 by Jeff Chiles, Chiles, Jeff, Sonia Buckley +9
Engineering · Physics and Astronomy · #Applied Physics (physics.app-ph) #FOS: Physical sciences #Optics (physics.optics) #Photonic Crystals and Applications #Photonic and Optical Devices #Semiconductor Lasers and Optical Devices #physics.app-ph #physics.optics

paper · pdf · doi:10.48550/arxiv.1708.09438

arxiv created 2017/08/15 · openalex publication_date 2017/08/15 · arxiv updated 2017/09/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28

Abstract

We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and characterized, demonstrating <3×10^-4 dB loss per out-of-plane waveguide crossing, 0.05 ± 0.02 dB per interplane coupler, and microring resonators on three planes with a quality factors up to 8.2 × 10⁴. We also explore a phase velocity mapping strategy to mitigate the crosstalk between co-propagating waveguides on different planes. These results expand the utility of 3D photonic integration for applications such as optical interconnects, neuromorphic computing and optical phased arrays.

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