2014/09/01 by H. Lundén, Tero Kumpulainen, Antti Matanen +1 · 1 citation
Engineering · #3D IC and TSV technologies #Additive Manufacturing and 3D Printing Technologies #Laser Material Processing Techniques
paper · doi:10.1109/estc.2014.6962719
openalex publication_date 2014/09/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/29
Conventional glass bonding methods do not fill all the requirements set by the industry. A novel hermetic room temperature glass welding technology was investigated. The aim was to avoid additive materials and multistep manufacturing process as well as minimize the heat affect. However, a good quality hermetic, mechanically sound bond was desired. In this study, a temperature cycling test was performed to glass samples welded with this novel technology. Notable advantages of using the novel welding technology were discovered: resistance of rapid temperature changes, excellent mechanical properties, room temperature welding, and hermetic encapsulation can be achieved. Use of only one material ensures that no problems with different temperature coefficients will be appeared. As a result, a newly develop glass welding technology can offer solution for the novel challenges set by the industry.