2005/06/29 by Woong Sun Lee, Jin Yu · 1 citation
Engineering · Materials Science · #3D IC and TSV technologies #Electronic Packaging and Soldering Technologies #Thermal properties of materials
paper · doi:10.1016/j.diamond.2005.05.008
openalex publication_date 2005/06/29 · crossref created 2005/06/29 · crossref issued 2005/10/01 · crossref published 2005/10/01 · crossref published-print 2005/10/01 · crossref deposited 2019/01/24 · openalex created_date 2025/10/10 · crossref indexed 2026/08/04 · openalex updated_date 2026/08/04