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Low bend loss waveguides enable compact, efficient 3D photonic chips

2013/01/31 by Alexander Arriola, Simon Gross, Nemanja Jovanovic +8 · 162 citations
Engineering · Physics and Astronomy · #Integrated optics #Materials science #Optics #Optoelectronics #Photonic Crystals and Applications #Photonic and Optical Devices #Photonic integrated circuit #Photonics #Physics #Semiconductor Lasers and Optical Devices #physics.optics

paper · pdf · open access · doi:10.1364/oe.21.002978

published in Optics Express 21(3), 2978 (Optica Publishing Group) · 9 pages, 6 figures

openalex publication_date 2013/01/31 · arxiv created 2013/02/11 · arxiv updated 2013/02/13 · openalex created_date 2025/10/10 · openalex updated_date 2026/08/05

Abstract

We present a novel method to fabricate low bend loss femtosecond-laser written waveguides that exploits the differential thermal stabilities of laser induced refractive index modifications. The technique consists of a two-step process; the first involves fabricating large multimode waveguides, while the second step consists of a thermal post-annealing process, which erases the outer ring of the refractive index profile, enabling single mode operation in the C-band. By using this procedure we report waveguides with sharp bends (down to 16.6 mm radius) and high (80%) normalized throughputs. This procedure was used to fabricate an efficient 3D, photonic device known as a "pupil-remapper" with negligible bend losses for the first time. The process will also allow for complex chips, based on 10's - 100's of waveguides to be realized in a compact foot print with short fabrication times.

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