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Thermal stability of thermoelectric materials via in situ resistivity measurements

2012/06/11 by K. C. Lukas, Kevin Lukas, W. S. Liu +6
Engineering · Materials Science · Physics and Astronomy · #Advanced Thermoelectric Materials and Devices #Chemical engineering #Composite material #Electric resistivity #Electrical resistivity and conductivity #In situ #Materials science #Physics #Thermal Radiation and Cooling Technologies #Thermal conductivity #Thermal properties of materials #Thermal stability #Thermodynamics #Thermoelectric effect #Thermoelectric materials #cond-mat.mtrl-sci

paper · pdf · doi:10.1063/1.4767904

arxiv created 2012/06/11 · openalex publication_date 2012/11/01 · arxiv updated 2012/12/05 · openalex created_date 2016/06/24 · openalex updated_date 2026/08/05

Abstract

An experimental setup for determining the electrical resistivity of several types of thermoelectric materials over the temperature range 20 < T < 550 °C is described in detail. One resistivity measurement during temperature cycling is performed and explained for Cu(0.01)Bi(2)Te(2.7)Se(0.3) and a second measurement is made on Yb(0.35)Co(4)Sb(12) as a function of time at 400 °C. Both measurements confirm that the materials are thermally stable for the temperature range and time period measured. Measurements made during temperature cycling show an irreversible decrease in the electrical resistivity of Cu(0.01)Bi(2)Te(2.7)Se(0.3) when the measuring temperature exceeds the maximum sample fabrication temperature. Several other possible uses of such a system include but are not limited to studying the effects of annealing and/or oxidation as a function of both temperature and time.

Citations