1998/06/14 by S. Bogdanovich, M. P. Sarachik, R. N. Bhatt · 2 citations
Chemistry · Engineering · Physics and Astronomy · #Advancements in Semiconductor Devices and Circuit Design #Chemistry #Composite material #Condensed matter physics #Conductivity #Electrical resistivity and conductivity #Insulator (electricity) #Materials science #Metal #Metallurgy #Metal–insulator transition #Physics #Scaling #Semiconductor materials and devices #Semiconductor materials and interfaces #Stress (linguistics) #Transition metal #cond-mat.str-el
paper · pdf · doi:10.1103/physrevlett.82.137
arxiv created 1998/06/14 · openalex publication_date 1999/01/04 · arxiv updated 2009/11/30 · openalex created_date 2025/10/10 · openalex updated_date 2026/08/05
Using uniaxial stress S to tune Si:B through the metal-insulator transition at a critical value Sc, we find the dc conductivity at low temperatures shows an excellent fit to the scaling form \ensuremathσ(S,T)\phantom\rule0ex0ex=\phantom\rule0ex0exATxf[(S\ensuremath-Sc)/Ty] on both sides of the transition. The scaling functions yield reliable determinations of the temperature dependence of the conductivity in the metallic and insulating phases in the critical region.