2008/01/22 by Martin Trinker, M. Trinker, Sönke Groth +10 · 1 citation
Physics and Astronomy · #Advanced Frequency and Time Standards #Cold Atom Physics and Bose-Einstein Condensates #Quantum, superfluid, helium dynamics #physics.atom-ph #physics.ins-det
paper · pdf · doi:10.1063/1.2945893
published as Appl. Phys. Lett. 92, 254102 (2008) · 4 pages, 5 figures
arxiv created 2008/01/22 · openalex publication_date 2008/06/23 · arxiv updated 2009/12/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
We employ a combination of optical and electron-beam lithography to create an atom chip combining submicron wire structures with larger conventional wires on a single substrate. The multilayer fabrication enables crossed wire configurations, greatly enhancing the flexibility in designing potentials for ultracold quantum gases and Bose–Einstein condensates. Large current densities of >6×107A∕cm2 and high voltages of up to 65V across 0.3μm gaps are supported by even the smallest wire structures. We experimentally demonstrate the flexibility of the next generation atom chip by producing Bose–Einstein condensates in magnetic traps created by a combination of wires involving all different fabrication methods and structure sizes.