2007/10/31 by Takahiro Hatano, Tetsuya Kaneko, Yousuke Abe +1
Engineering · Materials Science · Physics and Astronomy · #Fusion materials and technologies #Metal and Thin Film Mechanics #Microstructure and mechanical properties #cond-mat.mtrl-sci #cond-mat.soft
paper · pdf · doi:10.1103/physrevb.77.064108
published as Physical Review B Vol.77, 064108 (2008)
arxiv created 2007/12/19 · openalex publication_date 2008/02/15 · arxiv updated 2009/12/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300\phantom\rule0.3em0exK, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress.