2007/08/29 by S. Gomès, Séverine Gomès, Po Chapuis +12
Engineering · Materials Science · Physics and Astronomy · #Force Microscopy Techniques and Applications #Near-Field Optical Microscopy #Thermal properties of materials #physics.class-ph
paper · pdf · doi:10.1109/tcapt.2007.901748
published as IEEE Transactions on Components and Packaging Technologies 30, 3 (2007) 424-431
openalex publication_date 2007/08/29 · arxiv created 2007/11/28 · arxiv updated 2009/12/01 · openalex created_date 2016/06/24 · openalex updated_date 2026/07/28
Surface temperature measurements were performed with a scanning thermal microscope mounted with a thermoresistive wire probe of micrometric size. A CMOS device was designed with arrays of resistive lines 0.35 mum in width. The array periods are 0.8 mum and 10 mum to study the spatial resolution of the SThM. Integrated circuits (ICs) with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an ac current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10 mum. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.