Electromigration in submicron interconnect features of integrated circuits

2010/10/30 by H. Ceric, S. Selberherr · 1 citation
Engineering · Materials Science · #Copper Interconnects and Reliability #Electronic Packaging and Soldering Technologies #Semiconductor materials and devices

paper · doi:10.1016/j.mser.2010.09.001

openalex publication_date 2010/10/30 · crossref created 2010/10/30 · crossref issued 2011/02/04 · crossref published 2011/02/04 · crossref published-print 2011/02/04 · crossref deposited 2018/12/07 · openalex created_date 2025/10/10 · crossref indexed 2026/04/09 · openalex updated_date 2026/07/28

Citations

• Statistical-Mechanical Theory of Irreversible Processes. I. General Theory and Simple Applications to Magnetic and Conduction Problems
• A linear theory of thermochemical equilibrium of solids under stress

Cited by

• Siegfried Selberherr [wikipedia]