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A comparative study of two simulation methods for thermal analysis of power electronic devices

2003/01/02 by Andrzej Napieralski, A. Skorek, J.M. Dorkel · 1 citation
Computer Science · Engineering · Physics and Astronomy · #Electromagnetic Scattering and Analysis #Induction Heating and Inverter Technology #Matrix Theory and Algorithms

paper · doi:10.1109/cipe.1992.247285

openalex publication_date 2003/01/02 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/29

Abstract

The authors compare two methods applied to 3D temperature map computation of power hybrid circuits. The first is the conventional FE method, and the second, so-called thermal influence coefficient method (TIC), is a specific procedure devised for fast temperature computations of hybrid power circuits. The numerical methods designed for true 3D thermal analyses have been implemented in programs running on PC-AT microcomputers.>

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