1979/10/01 by Richard A. Matula · 1,003 citations
Chemistry · Engineering · Physics and Astronomy · #Analytical Chemistry (journal) #Chemistry #Classical mechanics #Condensed matter physics #Copper #Electrical resistivity and conductivity #Electronic Packaging and Soldering Technologies #Interpolation (computer graphics) #Melting point #Metallurgical Processes and Thermodynamics #Palladium #Physics #Surface and Thin Film Phenomena #Thermodynamics #Work (physics)
paper · doi:10.1063/1.555614
published in Journal of Physical and Chemical Reference Data 8(4), 1147-1298 (American Institute of Physics)
openalex publication_date 1979/10/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/08/05
In this work, recommended values for the electrical resistivity as a function of temperature from the cryogenic region to well beyond the melting point are given for bulk pure copper, gold, palladium, and silver. In addition to the total electrical resistivity values for the solid state, intrinsic electrical resistivity values are presented from cryogenic temperatures to the melting point. The values are corrected for the change in geometry due to thermal expansion. The recommendations are based on theoretical considerations and on the experimental data found in the open literature. That available experimental data together with information pertaining to the specimen characterization and measurement conditions are included in this work. The methods of data evaluation and other considerations used in arriving at the recommendations are described. For the solid state, an interpolation scheme is given to aid in the determination of values between those supplied in the tables; for the liquid state, equations are given.