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Impact of Physical Deformation on Electrical Performance of Paper-Based Sensors

2017/01/23 by Joanna M. Nassar, Muhammad M. Hussain · 2 citations
Engineering · #Advanced Sensor and Energy Harvesting Materials #Bending #Biosensors and Analytical Detection #Composite material #Computer science #Deformation (meteorology) #Electrical engineering #Electronics #Embedded system #Engineering #Key (lock) #Materials science #Mechanical engineering #Nanomaterials and Printing Technologies #Power (physics) #Reliability (semiconductor) #Stress (linguistics) #Wearable computer #Wearable technology

paper · doi:10.1109/ted.2017.2650981

openalex publication_date 2017/01/23 · openalex created_date 2025/10/10 · openalex updated_date 2026/08/01

Abstract

We report on investigation of the mechanical properties of paper electronics (printed and made out of paper). One key objective of such paper electronics is to achieve ultraflexibility. Therefore, it is important to understand electrical functionality and reliability of paper electronics under various physical (mechanical) deformations. Here, we show the general mechanical properties of the cellulose paper used and its electrical behavior under applied strain, tackling the main effects that need to be identified when building paper-based systems, from product performance and stability perspective. An overview of the stress-strain behavior of silver ink on paper is discussed, and then, we tackle a more specific analysis of the performance variations of paper sensors made with recyclable household materials when exposed to various mechanical conditions of tensile and compressive bending. This paper is important for developing stable wearable sensors for incorporation into Internet of Everything applications.

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