Atomic level surface roughness of epoxy resin induced by novel chemical mechanical polishing with high material removal rate and its mechanisms elucidated using molecular dynamics simulations and density functional theory

2025/01/01 by Jiaxin Li, Zhenyu Zhang, Hongxiu Zhou +3 · 1 voice
Engineering · Materials Science · Physics and Astronomy · #Advanced Surface Polishing Techniques #Diamond and Carbon-based Materials Research #Force Microscopy Techniques and Applications

paper · doi:10.1039/d5nr01627d

openalex publication_date 2025/01/01 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/23

Abstract

, and this conformation was the most stable. During adsorption, 0.012 eV of energy was transferred to dichloromethane from the small crosslinked molecules. Molecular dynamics simulations and density functional theory were used to perform these calculations. Dichloromethane relaxed the resin surface, speeding up the migration rate of chains and reducing their energy of breaking. The combined effect of mechanical shear force, compressive force and relaxation of swelling led to the breakage of C-N bonds with the lowest energy in the chains. The broken short chains were wrapped in dichloromethane, separating from the surface of the resin with the slurry flow. Our results provide new insights into acquiring an atomic level epoxy resin surface with soft-plastic, thermal softening and corrosion resistance characteristics.

Citations

• van der Waals Volumes and Radii
• Exploring Nature and Predicting Strength of Hydrogen Bonds: A Correlation Analysis Between Atoms‐in‐Molecules Descriptors, Binding Energies, and Energy Components of Symmetry‐Adapted Perturbation Theory
• Independent gradient model based on Hirshfeld partition: A new method for visual study of interactions in chemical systems
• Laser machining fundamentals: micro, nano, atomic and close-to-atomic scales
• A novel approach of jet polishing for interior surface of small-grooved components using three developed setups

Discussions

• In this work, a novel chemical mechanical polishing (CMP) was developed for epoxy resin, and the CMP slurry included ceria, dichloromethane, sodium carboxymethyl cellulose and deionised water. Check [bsky, 0 points, 0 comments]