2025/02/20 by Jinbo He, Jinjian Yan, Tao Xue +8 · 1 voice
Engineering · #Advancements in Semiconductor Devices and Circuit Design #Integrated Circuits and Semiconductor Failure Analysis #Semiconductor materials and devices
paper · doi:10.1002/smm2.1318
openalex publication_date 2025/02/20 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/22
ABSTRACT Two‐dimensional (2D) materials, such as MoS 2 , show exceptional potential for next‐generation electronics. However, the poor stability of these materials, particularly under long‐term operations and high temperature, impedes their practical applications. Here, we develop a terminal passivation interface decoupling (TPID) strategy to significantly improve the stability of MoS 2 , by mitigating the interaction between the substrate and the 2D material within the in‐situ growth process. Specifically, the strong electron‐withdrawing terminal group hydroxyl, prevalent on the oxide substrate, is passivated by carbon groups. Due to this, the structure of MoS 2 materials remains stable during long‐term storage, and its electronic devices, field‐effect transistors (FETs), show remarkable operational and high‐temperature (400°C) stability over 60 days, with much‐improved performance. For example, mobility increases from 9.69 to 85 cm 2 /(V·s), the highest value for bottom‐up transfer‐free single crystal MoS 2 FETs. This work provides a new avenue to solve reliability issues of 2D materials and devices, laying a foundation for their applications in the electronic industry.