2020/06/25 by Maryam Mesgarpour Tousi, Mona Ghassemi, Tousi, Maryam Mesgarpour +1
Engineering · Materials Science · Physics and Astronomy · #Applied Physics (physics.app-ph) #FOS: Physical sciences #High voltage insulation and dielectric phenomena #Lightning and Electromagnetic Phenomena #Power Transformer Diagnostics and Insulation
paper · pdf · doi:10.48550/arxiv.2006.14657
openalex publication_date 2020/06/25 · openalex created_date 2022/07/26 · openalex updated_date 2026/07/28
As shown in our previous studies, geometrical field grading techniques such\nas stacked and protruding substrate designs cannot well mitigate high electric\nstress issue within power electronics modules. However, it was shown that a\ncombination of protruding substrate design and applying a nonlinear\nfield-dependent conductivity layer could address the issue. Electric field (E)\nsimulations were carried out according to IEC 61287-1 for the partial discharge\ntest measurement step, where a 50/60 Hz AC voltage was applied. However,\ndielectrics, including ceramic substrate and silicone gel, in power devices\nundergo high temperatures up to a few hundred degrees and frequencies up to 1\nMHz. Thus, E values obtained with electrical parameters of the mentioned\ndielectrics for room temperature and under 50/60 Hz may not be valid for high\ntemperatures and frequencies mentioned above. In this paper, we address this\ntechnical gap through developing a finite element method (FEM) E calculation\nmodel developed in COMSOL Multiphysics where E calculations are carried out for\ndifferent temperatures up to 250 C and frequencies up to 1 MHz. Using the\nmodel, the influence of temperature and frequency on our proposed electric\nfield mitigation technique mentioned above is evaluated.\n