2024/08/26 by Qianxu Xia, Lianmin Zheng, Xia, Qianxu +3
Materials Science · #Accelerator Physics (physics.acc-ph) #Copper Interconnects and Reliability #FOS: Physical sciences #Metallurgy and Material Science #Plasma Physics (physics.plasm-ph)
paper · pdf · doi:10.48550/arxiv.2408.14386
openalex publication_date 2024/08/26 · openalex created_date 2024/09/21 · openalex updated_date 2026/07/28
To assess the feasibility of in-situ plasma cleaning for copper cavities, a 13.56 MHz inductively coupled plasma platform with a built-in coil was developed at Tsinghua University. Experiments were conducted using this platform to optimize plasma discharge parameters and procedures specific to copper cavities. The results indicate that the "Ar/O + Ar/H method" significantly enhances the work function of the copper surface while reducing field enhancement effects induced by surface burrs. Consequently, this study confirms that in-situ plasma cleaning effectively mitigates field emission within copper cavities, thereby enhancing the stability and acceleration gradient of the accelerator system.