1960/01/01 by Barry D. Lichter, B. D. Lichter, Carl Wagner
Earth and Planetary Sciences · Engineering · #nanoparticles nucleation surface interactions #Electrodeposition and Electroless Coatings #High-Temperature Coating Behaviors
paper · doi:10.1149/1.2427646
Copper‐gold alloys involving 10 and 33 mole % Au and Ag‐Au alloys involving 12 mole % Au are attacked by liquid or gaseous sulfur above 400°C very rapidly with formation of a composite scale consisting of an outer homogeneous sulfide layer and an inner two‐phase layer involving Au‐rich alloy and sulfide in accord with theoretical considerations regarding the instability of a plane alloy‐sulfide interface. The tendency to form a rugged alloy‐sulfide interface decreases with higher Au contents especially at lower temperatures and the rate of attack by sulfur decreases accordingly. Silver‐copper alloys involving 40 mole % Cu are also rapidly sulfidized at 400°C and yield a single sulfide layer of uniform thickness. Nickel‐copper alloys sulfidized at 400°C yield a scale consisting of an outer layer which is supposedly digenite , and an inner layer which is supposedly a solid solution of in nickel sulfide.