2013/07/16 by G. Deptuch, U. Heintz, Ulrich Heintz +22 · 1 citation
Engineering · Physics and Astronomy · #3D IC and TSV technologies #CCD and CMOS Imaging Sensors #FOS: Physical sciences #High Energy Physics - Experiment (hep-ex) #Instrumentation and Detectors (physics.ins-det) #Particle Detector Development and Performance #hep-ex #physics.ins-det
paper · pdf · doi:10.48550/arxiv.1307.4301
Whitepaper submitted to the Snowmass Instrumentation Frontier
arxiv created 2013/07/16 · openalex publication_date 2013/07/16 · arxiv updated 2013/07/17 · openalex created_date 2025/10/10 · openalex updated_date 2026/07/28
We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully active sensor/readout chip tiles which can be assembled into large area arrays with good yield and minimal dead area. The ability to connect though the bulk of the device can also provide better electrical performance and lower mass.