2021/04/16 by Zhun‐Yong Ong, Gang Zhang, Ong, Zhun-Yong +3
Engineering · Environmental Science · Materials Science · #FOS: Physical sciences #Materials Science (cond-mat.mtrl-sci) #Mesoscale and Nanoscale Physics (cond-mat.mes-hall) #Smart Materials for Construction #Thermal Radiation and Cooling Technologies #Thermal properties of materials
paper · pdf · doi:10.48550/arxiv.2104.07975
openalex publication_date 2021/04/16 · openalex created_date 2021/04/26 · openalex updated_date 2026/07/28
Understanding the limits of phononic heat dissipation from a two-dimensional layered material (2DLM) to its hexagonal boron nitride (h-BN) substrate and how it varies with the structure of the 2DLM is important for the design and thermal management of h-BN-supported nanoelectronic devices. We formulate an elasticity-based theory to model the phonon-mediated heat dissipation between a 2DLM and its h-BN substrate. By treating the h-BN substrate as a semi-infinite stack of harmonically coupled thin plates, we obtain semi-analytical expressions for the thermal boundary conductance (TBC) and interfacial phonon transmission spectrum. We evaluate the temperature-dependent TBC of the N-layer 2DLM (graphene or MoS2) on different common substrates (h-BN vs. a-SiO2) at different values of N. The results suggest that h-BN is substantially more effective for heat dissipation from MoS2 than a-SiO2 especially at large N. To understand the limitations of the our stack model, we also compare its predictions in the N=∞ limit to those of the more exact Atomistic Green's Function model for the graphite-BN and molybdenite-BN interfaces. Our stack model provides clear insights into the key role of the flexural modes in the TBC and how the anisotropic elastic properties of h-BN affect heat dissipation.