2023/03/05 by Huang, Andrew 'bunnie'
#Applied Physics (physics.app-ph) #B.m #Cryptography and Security (cs.CR) #FOS: Computer and information sciences #FOS: Electrical engineering #FOS: Physical sciences #Hardware Architecture (cs.AR) #Image and Video Processing (eess.IV) #electronic engineering #information engineering
paper · doi:10.48550/arxiv.2303.07406
This paper introduces the Infra-Red, In Situ (IRIS) inspection method, which uses short-wave IR (SWIR) light to non-destructively "see through" the backside of chips and image them with lightly modified conventional digital CMOS cameras. With a ~1050 nm light source, IRIS is capable of constraining macro- and meso-scale features of a chip. This hardens existing micro-scale self-test verification techniques by ruling out the existence of extra circuitry that can hide a hardware trojan with a test bypass. Thus, self-test techniques used in conjunction with IRIS can ensure the correct construction of security-critical hardware at all size scales.